As mobile electronic devices get smaller and smarter, manufacturers of advanced logic semiconductors must produce high-performance, sub-10nm logic chips in ever-increasing quantities. To compete effectively for lucrative advanced logic opportunities, manufacturers must overcome a number of technical challenges.
Key fab challenges:
- Reduce contact resistance
- Ensure defect-free epitaxy
- Minimize particle and metal contamination
Axcelis solution:
We help advanced logic chip manufacturers address these challenges with the industry’s most advanced ion implantation solutions. Our Purion platforms provide:
- Precise angle control with our exclusive Vector™ Control System
- Unmatched particulate and metals contamination control
- Wide temperature range for both hot and cold implant
- Materials modification capabilities
- Gallium implant capabilities
Learn about our Purion solutions for High Current, High Energy or Medium Current, or Medium Energy.
Purion Vector Dose and Angle Control System
Purion Shield Contamination Defense